Bonding chips to substrates or lead frames quickly and accurately.
"INFINITE" is a device that can bond individual chips to substrates and lead frames with ultra-high speed and precision. It is capable of controlling not only the amount and width of epoxy resin dispensed but also the amount of overflow during bonding. It also features inspection functions before and after dispensing and bonding, making it suitable for various applications such as QFN, BGA, MEMS, and SiP. 【Features】 ■ High-speed bonding of thin chips and large dies ■ Compatible with various epoxy materials, including pressureless sintering materials and high-viscosity materials ■ Alignment accuracy of ±20μm @ 3σ ■ Capable of processing at a maximum speed of 0.19 seconds per chip ■ Die size compatibility: 0.2×0.2 to 9×9mm Substrate size compatibility: Length 100 to 300mm, Width 15 to 100mm *You can view the product documentation from the <PDF download>.
Inquire About This Product
basic information
[About ASMPT's Flip Chip/Die Bonder] We offer a lineup of products with alignment accuracy ranging from 0.2μm to 25μm and cycle times from 18 seconds to 0.16 seconds. We will propose equipment based on the size of the die and substrate, as well as the bonding method. In addition to die bonders, we have a wide range of back-end equipment, including laser dicing machines, wire bonding machines, AOI equipment, molding machines, and sintering machines. *Please feel free to contact us if you are looking for back-end equipment.*
Price information
Please contact us.
Delivery Time
※Please contact us.
Applications/Examples of results
Various packages and applications such as QFN, BGA, MEMS, SiP, thin chips, and large dies.
catalog（1）
Download All Catalogs
Company information
Our company started in 1982 as a technical trading company specializing in the sales and maintenance services of semiconductor manufacturing equipment imported from overseas, as a group company of Kanematsu Corporation. Recently, in order to meet the diverse needs of our customers, we have been committed to ensuring that not only manufacturing equipment but also overseas products such as parts, materials, and subsystems can be used with confidence by our customers. While being a trading company, we have enhanced our technical department, which is responsible for planning, development, design, and manufacturing, to propose comprehensive technical solutions and expand our business globally to customers both domestically and internationally. In the future, we aim to continue being a company that provides new added value and services as an electronics technology trading company, growing together with our customers.
