Easy epoxy bonding is possible.
A machine that easily performs epoxy and silver paste die bonding. The model 7200CR epoxy die bonder features a dispensing tube for applying epoxy materials (adhesives) and silver paste, along with a pickup tool for attracting chips, all integrated into a single bond head. With the operation of the new X-Y-Z three-axis manipulator (patented), it is possible to switch between dispensing mode and pickup mode, as well as perform die bonding. Additionally, since the bond head is equipped with a motor and timing belt, the chips attracted by the pickup tool can be rotated freely 360° using the control knob at hand. Furthermore, by setting the die puff time, the chips smoothly detach from the pickup collet, improving bonding efficiency.
Inquire About This Product
basic information
A machine that allows for easy epoxy and silver paste die bonding. The model 7200CR epoxy die bonder features a dispensing tube for applying epoxy material (adhesive) and silver paste, along with a pickup tool for attracting chips, all integrated into a single bond head. With the operation of the new X-Y-Z three-axis manipulator (patented), it is possible to switch between dispensing mode and pickup mode, as well as perform die bonding. Additionally, since the bond head is equipped with a motor and timing belt, the chips attracted by the pickup tool can be rotated freely 360° using the control knob at hand. Furthermore, by setting the die puff time, the chips smoothly detach from the pickup collet, improving bonding efficiency.
Price information
-
Delivery Time
Applications/Examples of results
Mounting chips on LED chips and IC cards, etc.
Company information
We will listen to your requests and provide the optimal solution.
![[VOC Exhaust Gas Treatment Device] Catalytic Combustion Type Deodorization Device [CT Series]](https://image.mono.ipros.com/public/product/image/854/2001482680/IPROS61321671107423185282.jpeg?w=280&h=280)