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Dexerials produces and sells two types of tapes: "adhesive tape" and "bonding tape." Literally, adhesive tape has "adhesive" applied to a core material or film, while bonding tape has "bonding agent" applied. The adhesive is required to gently hold parts in place compared to the bonding agent, and it is characterized by the ability to be removed even after being applied. In contrast, the bonding agent is designed to hold parts more securely and is generally not meant to be removed once applied. In addition to bonding strength, there are the following differences between bonding tape and adhesive tape: - The adhesive in adhesive tape does not change its properties before and after application, while the bonding agent in bonding tape hardens and changes its properties due to stimuli such as temperature, humidity, and ultraviolet light. - There is a difference in the freedom of shape of the adherend. - Bonding tape holds the adherend more securely, resulting in less deformation or displacement due to stress. - The heat resistance after bonding and adhesion differs (bonding tape can maintain its bonded state at high temperatures compared to adhesive tape). - The storage temperatures are different. *For more detailed information, please refer to the related links. Feel free to contact us for more details.
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【Adhesive Tape in Flexible Printed Circuits (FPC)】 In electronic devices where our products are used, adhesive tape is commonly utilized for the bonding of flexible printed circuit boards (abbreviated as FPC). FPC refers to a substrate that incorporates wiring for electronic circuits on a very thin film. Additionally, adhesive tape used in FPCs often has conductivity imparted by mixing in conductive fillers. To mount components on the FPC, a soldering process called "reflow" is necessary. In the reflow process, cream solder, which is a paste made by mixing powdered solder with rosin and other materials, is pre-printed onto the substrate. Components are then placed on top of this, and by passing through a "reflow oven" that reaches a maximum temperature of about 260°C, the solder is melted to assemble the components. During this process, the areas where the adhesive tape is bonded to the reinforcement board also reach high temperatures, so sufficient heat resistance is required. *For more detailed information, please refer to the related links. For further inquiries, feel free to contact us.*
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Dexerials Corporation has business offices and sales bases not only in Japan but also in Asia, including China, as well as in Europe and the United States. We continue to provide products with new value that meet customer needs tailored to each market. By adding new technologies to our existing products, we aim to maintain and strengthen our business. Moving forward, we will boldly challenge the automotive and life sciences sectors, steadily nurturing and expanding new businesses, while advancing the development of technologies that will pave the way for the future. As a company that creates new value that is not found anywhere else, we strive to maximize customer value and continue to challenge ourselves to become a trusted partner for our customers and society.
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