Achieving low prices with a simple structure! Introducing the GaN wafer low-damage etching device.
We would like to introduce our "PEC Process Equipment." You can choose the light source and wavelength from UVA and UVC, enabling high-speed deep etching through the heating of the etching solution. Etching rinse parameters can be set via a touch panel input. Please feel free to contact us when you need assistance. 【Features】 ■ From 10mm square small chips to φ6 inch wafers ■ Capable of low-damage etching for GaN ■ Achieves low cost with a simple structure ■ Enables high-speed deep etching *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications】 ■Model: PEC-6 ■Etching Method ・Photo-Electro Chemical ■Applicable Work: □10mm small chip, φ2 to 6 inches ■UVA Light Source: Ultra-high pressure mercury lamp 315–400nm 15mW/sm2 or more ■UVC Light Source: Plasma light source 220–320nm 12mW/sm2 or more ■Chemical Supply: 2 nozzle air compression method for etching solution and rinse solution ■External Dimensions: 1470 (H) × 650 (W) × 750 (D) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Until now, we have continuously faced challenges with the desire to propose optimal system integration to our customers while sensitively responding to the trends of the times in industries such as paper, pulp, automotive, automotive parts, semiconductors, LCDs, and smartphones. Moving forward, we will actively enter the "three industries" of "food, pharmaceuticals, and cosmetics," which are essential for people's lives, while inheriting this way of thinking. Additionally, in fields expected to grow, such as semiconductors and high-performance LCDs, we will actively engage in the development and manufacturing of precision alignment exposure equipment, inspection equipment, and process manufacturing equipment as a device manufacturer.