We can provide simple thermal analysis solutions for issues related to the substrate's "heat."
In terms of heat dissipation measures for the substrate, pre-simulation is crucial. Our company will confirm various heat dissipation conditions of the substrate during the estimation and provide "simple thermal analysis."
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basic information
- Calculation of PCB equivalent thermal conductivity - Check for component heat dissipation feasibility - Estimation of device surface temperature, etc. During the estimation phase, we will verify various thermal conditions according to the project and, based on a simplified thermal analysis, propose various heat dissipation measures if necessary.
Price information
Free at the time of estimation.
Delivery Time
Applications/Examples of results
Numerous achievements in thermal analysis.
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Company information
P-Dub-B Co., Ltd. has been expanding its business areas related to printed circuit boards since its establishment in 1978, and now has built a consistent production system (ADAMS) that handles everything in-house, from software and hardware design to manufacturing and assembly. We flexibly respond to our customers' increasingly diverse and sophisticated needs.
![[Data] Introduction of Induction Heating Furnace in the Manufacturing Process of High-Pressure Cylinders and Measurement Evaluation Results](https://image.mono.ipros.com/public/product/image/d3f/2000572480/IPROS06024467894843830319.jpeg?w=280&h=280)
