Even control panels the height of a human can be handled! We conduct simulations to achieve stable operation.
At Fair Co., Ltd., we design high-speed, high-density, multi-layer printed circuit boards. We can also manufacture using MEGTRON materials and flexible substrates. For boards that require high-speed transmission and noise consideration, we perform impedance matching and simulations to achieve stable operation. Additionally, we can provide services such as cutting, casting, mold design, and delivery of resin molded products. We can accommodate units the size of a palm as well as control panels the height of a human. 【Other Process Examples (Excerpt)】 ■ Product Planning ■ Circuit Design ■ CPU Firmware Design ■ FPGA Design ■ Manufacturing, Assembly, Inspection, Packaging *For more details, please refer to the related links or feel free to contact us.
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We believe that quality and timely delivery are everything when it comes to our products. For any product, we set goals for outcomes and carry out designs to achieve high functionality and precision, resulting in a high-quality finished product—that is our wish. Moreover, we prioritize consistent cost reduction and quality improvement from the initial stages of design. We explore all possible directions, from logical diagrams to circuit diagrams, in order to meet user needs. We aim to efficiently and rationally realize the close relationship between software and hardware, and we incorporate considerations of cost into how we develop products. This philosophy is at the core of our design process, and we work to integrate all sections in product development and manufacturing.