[Example] Semiconductor manufacturing equipment machine frame

The joints between the square pipes are processed to maintain strength through full circumferential welding!

We would like to introduce the "Semiconductor Manufacturing Equipment Machine Frame" that we designed and manufactured. The material used is an equilateral angle pipe of size 50*50. It is assembled through welding. Additionally, this machine frame serves as the base for the equipment, and since heavy objects will be placed on the top surface, sufficient strength is required at the joints where the angle pipes are connected. Therefore, we have processed it to maintain strength through full circumferential welding. 【Product Attributes】 ■Industry: Semiconductor-related ■Process: Inspection process ■Features: Frame for laser marker ■Size: Overall length 1800 × width 1700 × height 710 ■Accuracy: ±0.5mm ■Material: Angle pipe SS400 SPCC + coating *For more details, please refer to the PDF document or feel free to contact us.

Other semiconductor manufacturing equipmentContract manufacturingOther contract services