Wafer Expansion Device | Wafer Expander TEX-220

A wafer expansion device equipped with an auto-cut function that can reduce operator workload and improve production efficiency.

Achieving the "excellent workability" sought by operators! This is a model of a wafer expansion device equipped with an automatic cutting function that was not available in conventional devices. The task of separating the excess film (dicing frame) that has been done until now will change to "just pressing a switch." The EX series "Wafer Expander" is a tape expansion device that can uniformly stretch fully cut wafers along with the dicing tape on the expansion stage, adjusting the chip spacing/street width to the appropriate width. By adopting a motor for the drive of the expansion stage, it is possible to manage the numerical values of the expansion stroke and expansion speed. Additionally, it comes standard with an auto-cut function. Technovision offers various wafer expanders, including basic models, motor-driven expanders compatible with 12-inch wafers, and expanders with auto-cut functions, allowing for selection based on requirements. After expansion, the grip ring (automatic clamping of the inner and outer rings) maintains the expanded state of the tape.

Wafer processing/polishing equipmentOther semiconductor manufacturing equipment