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  6. Wafer Expansion Device | Wafer Expander TEX-220

Wafer Expansion Device | Wafer Expander TEX-220

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TEX-220

last updated:May 10, 2023

TECHNOVISION, INC. main office
TECHNOVISION, INC. main office
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A wafer expansion device equipped with an auto-cut function that can reduce operator workload and improve production efficiency.

Achieving the "excellent workability" sought by operators! This is a model of a wafer expansion device equipped with an automatic cutting function that was not available in conventional devices. The task of separating the excess film (dicing frame) that has been done until now will change to "just pressing a switch." The EX series "Wafer Expander" is a tape expansion device that can uniformly stretch fully cut wafers along with the dicing tape on the expansion stage, adjusting the chip spacing/street width to the appropriate width. By adopting a motor for the drive of the expansion stage, it is possible to manage the numerical values of the expansion stroke and expansion speed. Additionally, it comes standard with an auto-cut function. Technovision offers various wafer expanders, including basic models, motor-driven expanders compatible with 12-inch wafers, and expanders with auto-cut functions, allowing for selection based on requirements. After expansion, the grip ring (automatic clamping of the inner and outer rings) maintains the expanded state of the tape.

    Wafer processing/polishing equipmentOther semiconductor manufacturing equipment
220e.jpg

Wafer Expansion Device | Wafer Expander TEX-220

220e.jpg
220e.jpg
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basic information

■Main Features - Expansion rate can be set arbitrarily. - Expansion speed can be set arbitrarily. - Stage equipped with a hot plate that enables high expansion rates. - Automatically grips the expanded film with a grip ring. - Equipped with an automatic film cutting mechanism. ■Customization Supports customer-specific specifications and special modifications such as safety switches, signal tower installation, damper specifications, etc.

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Applications/Examples of results

Dicing / a tape expansion device that uniformly expands the diced wafer in the X-Y direction, widens the chip spacing to any desired gap, and significantly improves chip handling after dicing / splitting.

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Model number overview
TEX-220 Up to 8 inches, device dimensions: 420mm (W) × 675mm (D) × 480mm (H)

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TechnoVision | Comprehensive Product Catalog

TechnoVision | Comprehensive Product Catalog

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TECHNOVISION,

TECHNOVISION, INC. main office

Electronic Components and Semiconductors

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Techno Vision Co., Ltd. has been engaged in the development, manufacturing, and import/export of its own products, focusing on cleaning technology and assembly technology since its establishment in September 1987. In today's high-tech industry, we are committed to responding to our customers' needs and providing technology, products, and services from the perspective of our customers.

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  • Wafer processing/polishing equipment
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