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  6. High Power LED Array Assembly Service

High Power LED Array Assembly Service

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last updated:May 11, 2023

佐用精機製作所
佐用精機製作所
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"I want to implement high-power UV irradiation LEDs with bear chips." At such times, we can assist you at each stage of design and manufacturing.

We have been assisting SANYO Electric for many years, from prototyping to mass production of LED-related implementations. Currently, we are also helping major electronics manufacturers with prototyping to mass production of bare chip implementations. In particular, UV LEDs often present challenges in design and manufacturing in the following areas: ◆ Deterioration due to light and heat, and material selection Introduction of engineers from material manufacturers and information on related materials from the past ◆ Structural selection for light countermeasures Heat shrink structures, heat dissipation structures, etc. ◆ Determining the LED mounting position, lens position, and mounting standards How to establish mounting standards ◆ Simultaneous multi-chip mounting methods with different wavelengths Simultaneous mounting of multiple chips (multi-chip bonder) ◆ Circuit design Ideas for averaging circuits to reduce the impact of heat on Vf ◆ Other preliminary experiments Proposals based on nearly 10,000 experimental cases centered around LED-related topics We can assist in resolving your issues for problem-solving.

    LED Module
1P1080212.jpg

High Power LED Array Assembly Service

1P1080212.jpg
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  • Related Link - http://www.sayo.co.jp/

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basic information

<As elements for service realization> In providing our services, we can offer the following elements of technology and implementation work. (Items marked with ☆ are external measurements) (Structural elements) - Assembly experiments using 3D CAD (Optical evaluation elements) - Spectral and optical power measurements using an integrating sphere (Thermal evaluation elements) - Tj (junction temperature) measurement (Electrical evaluation elements) - IV (current, voltage) measurement (Structural material evaluation elements) - Length measuring microscope - Differential thermal analysis (reference comparison level) - X-ray analysis☆ - SEM analysis☆ - FT-IR analysis☆ - Other analyses☆ (Implementation execution elements) - Automatic multi-chip bonder - Automatic wire bonder - Resin coating machine - Other experimental fixtures

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High-power LED lighting equipment, UV irradiation device design, and services available for mass production.

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佐用精機製作所

佐用精機製作所

Electronic Components and Semiconductors

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We assist those involved in the research and development of semiconductor devices and related materials as their hands and feet in solving problems. (1) Problem-Solving Support Services Research and development itself is the main theme of problem-solving. We leverage our experience from over 10,000 related prototypes to conduct investigations, analyses, and propose experiments. (2) Electronic Component Processing Services Especially for sensors, there are many irregular shapes that are difficult to accommodate with dedicated equipment. In cases of small quantities, investment balance can be an issue that prevents starting. We can propose production with minimal investment based on our experience in prototype support. We also provide support for small quantities until customers establish dedicated lines. (3) Prototype-Related Tool and Equipment Development Services At the beginning of semiconductor-related material development, there is a need to create devices and tools for functional evaluation. In most cases, dedicated evaluation devices exist, but they are multifunctional and expensive. You can utilize our services when a simple device for single-function comparative evaluation is needed in the early stages of development. We have a track record for applications such as sheet-related materials, package resins, encapsulation resins, phosphors, and QDs.

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