High efficiency / energy saving! It is possible to minimize thermal damage to the substrate and heat only the surface.
We would like to introduce the "Flash Lamp," which enables high throughput through bulk irradiation of large-area substrates. The light heating from this product utilizes the "absorption" characteristic of materials, allowing for self-heating by leveraging their properties of "reflection," "transmission," and "absorption." Additionally, since it is non-contact, it maintains a clean atmosphere and is not limited by the heating environment, whether in the atmosphere or in a vacuum. 【Features】 ■ Bulk irradiation of large areas - Enables high throughput through bulk irradiation of large-area substrates. ■ High efficiency / energy-saving - The wavelength from this product matches the absorption characteristics of Si, allowing for efficient heating. ■ Control of processing depth through pulse control - Minimizes thermal damage to the substrate and allows for heating of only the surface layer. *For more details, please refer to the related links or feel free to contact us.
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basic information
**Main Uses** ■ Sintering: Can sinter only the upper layer without damaging the resin substrate - Example: Conductive materials, crystalline materials, etc. ■ Bonding: Can bond without causing warping or other issues - Example: Bonding of optical discs, cover glass, and films, etc. ■ Surface Modification: Can modify the surface by instantaneously irradiating with high energy - Example: Removal of surface moisture, etc. ■ Peeling: Can reduce processing time by irradiating large areas at once - Example: Peeling OLEDs from support substrates, etc. *For more details, please refer to the related links or feel free to contact us.*
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Applications/Examples of results
【Applications】 ■ Formation of ultra-thin bonding layers ■ Formation of silicides ■ Formation of ultra-thin oxide films ■ Film formation for ferroelectric capacitors ■ Polymorphing (crystallization) of amorphous silicon ■ Sintering of metal nano inks and nano pastes (such as copper) ■ Activation annealing of Si and SiC substrates, etc. *For more details, please refer to the related links or feel free to contact us.
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Heating, hardening, cleaning, modification, surface treatment, adhesion, exposure, lighting, treatment, measurement, testing... When it comes to "light," leave it to Ushio. From light sources to units and light devices, we propose the optimal "light" tailored to your goals and applications with our unique light technology (we also offer joint experiments, joint research, and lending of demo and experimental equipment).
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