[July 10th - 11th] Notice of Participation in the "Implementation and Assembly Process Technology Exhibition"
Specialized in post-process automation! Introducing new equipment aimed at labor-saving for major domestic equipment manufacturers.
We will be exhibiting at the "Implementation and Assembly Process Technology Exhibition 2024" held at the Nagoya City Small and Medium Enterprise Promotion Hall. This exhibition specializes in post-process automation and will showcase new equipment aimed at labor-saving solutions from major domestic equipment manufacturers. We sincerely look forward to your visit. 【Event Overview (Excerpt)】 ■ Dates: July 10 (Wednesday) - July 11 (Thursday), 2024 ■ Hours: 10:00 AM - 5:00 PM *Last admission at 4:00 PM ■ Admission Fee: Free - General visitors: No registration required for factory representatives from manufacturing industries or equipment/product users (please submit 2 business cards at the reception) - Trading companies: Pre-registration is required *For more details, please refer to the PDF document or feel free to contact us.
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【Other Event Overview】 ■Venue: Nagoya City Small and Medium Enterprise Promotion Hall, 1F Fukiage Hall ■Address: 2-6-3 Fukiage, Chikusa Ward, Nagoya City, 464-0856 ■Nearest Station: Nagoya City Subway "Fukiage Station" Exit 5 → About a 5-minute walk *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."
