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  6. Aerial Wire Bonding Service (Circus)

Aerial Wire Bonding Service (Circus)

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last updated:Jun 02, 2023

佐用精機製作所
佐用精機製作所
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You can use it when you want to eliminate the influence of implementation materials and substrates.

Are you facing any of the following issues? - You have evaluated the temperature characteristics of MEMS, but the effects of the package and adhesive are significant and difficult to assess. - You want to evaluate the optical-electrical response characteristics of high-speed photodetectors, but the C component between the device and ground is significant and difficult to assess. - You want to measure the thermal characteristics of the device itself, but the effects of the package and adhesive are significant and difficult to assess. - You want to improve the rise time characteristics. It is possible to operate the chip in a suspended state with gold wire. The photo shows a wire bond on the back surface of a power LED.

    SensorsOptical Experimental PartsOther contract services
空中配線.JPG

Aerial Wire Bonding Service (Circus)

空中配線.JPG
空中配線.JPG
  • Related Link - http://www.sayo.co.jp/

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basic information

Please consult us to see if it can be applied due to the chip structure. As for our achievements: - Air wiring of MEMS on FR4 substrate - Air wiring of a light-receiving element to an SMA connector - Air wiring of power LEDs on a ceramic substrate

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Applications/Examples of results

- For element function evaluation - Experimental sample

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佐用精機製作所

佐用精機製作所

Electronic Components and Semiconductors

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We assist those involved in the research and development of semiconductor devices and related materials as their hands and feet in solving problems. (1) Problem-Solving Support Services Research and development itself is the main theme of problem-solving. We leverage our experience from over 10,000 related prototypes to conduct investigations, analyses, and propose experiments. (2) Electronic Component Processing Services Especially for sensors, there are many irregular shapes that are difficult to accommodate with dedicated equipment. In cases of small quantities, investment balance can be an issue that prevents starting. We can propose production with minimal investment based on our experience in prototype support. We also provide support for small quantities until customers establish dedicated lines. (3) Prototype-Related Tool and Equipment Development Services At the beginning of semiconductor-related material development, there is a need to create devices and tools for functional evaluation. In most cases, dedicated evaluation devices exist, but they are multifunctional and expensive. You can utilize our services when a simple device for single-function comparative evaluation is needed in the early stages of development. We have a track record for applications such as sheet-related materials, package resins, encapsulation resins, phosphors, and QDs.

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