We will solve your problems with experiments using AuSn (high-temperature solder).
Soldering with AuSn is used for joining electronic components that require high reliability. It has many advantages, such as utilizing its high melting temperature characteristics and being usable as an initial joining material when attempting to join materials. However, there are some difficulties compared to conventional soldering, such as: - Processing in areas exceeding 300°C - Need for atmosphere management during solder melting, such as in an N2 environment - The surface condition of the joined objects is influenced by the composition of the plating - Difficulty in positioning the workpiece during connection, etc. Our company has experience in mass production for optical pickups and communication LDs for major manufacturers. Through this experience, we have addressed many customer issues through prototyping. 【Service Features】 - Support including substrate design and joining jig design - For LED flicker chips, we can perform joining not only with non-flux but also with flux - We also have AIN submounts, LEDs, and packages in stock as experimental materials Please feel free to consult us if you have urgent experimental needs or any other concerns.
Inquire About This Product
basic information
For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
■ Single Beam LD Submount-LED junction, Submount-stem junction ■ Multi Beam LD Submount-LED junction, Submount-stem junction ■ High Power Flip Chip LED LED-substrate junction ■ Glass Lid: Package: Junction between glass ■ Others Junctions between components such as substrates, capacitors, etc.
catalog（3）
Download All Catalogs
Company information
We assist those involved in the research and development of semiconductor devices and related materials as their hands and feet in solving problems. (1) Problem-Solving Support Services Research and development itself is the main theme of problem-solving. We leverage our experience from over 10,000 related prototypes to conduct investigations, analyses, and propose experiments. (2) Electronic Component Processing Services Especially for sensors, there are many irregular shapes that are difficult to accommodate with dedicated equipment. In cases of small quantities, investment balance can be an issue that prevents starting. We can propose production with minimal investment based on our experience in prototype support. We also provide support for small quantities until customers establish dedicated lines. (3) Prototype-Related Tool and Equipment Development Services At the beginning of semiconductor-related material development, there is a need to create devices and tools for functional evaluation. In most cases, dedicated evaluation devices exist, but they are multifunctional and expensive. You can utilize our services when a simple device for single-function comparative evaluation is needed in the early stages of development. We have a track record for applications such as sheet-related materials, package resins, encapsulation resins, phosphors, and QDs.
