Are there any issues with the bonding strength of wire bonds, die bonds, and materials?
We will conduct a comparative measurement of the bonding strength at the junctions of wire bonds, die bonds, and materials. This is effective for addressing variations in bonding strength that may arise as a result of material development, element development, and substrate development. It is possible to evaluate issues related to the bonding strength of wire bonds, such as reliability and problems after heat treatment. We will compare the bonding strength itself in the state of the materials and assess the quality of strength among multiple samples. It is also possible to evaluate the effects of heat treatment. We also offer services to evaluate cases where the strength varies at the bonding surface. This can be utilized for material testing evaluations during mass production development. When the structure, material structure, or molecular structure between materials can be determined, it is possible to measure the bonding strength of the materials themselves. 【Examples】 - Comparative experiments on bonding strength when variations occur during the development of materials, elements, and substrates. - Evaluation when issues with bonding strength are found after heat treatment. - Comparative experiments on bonding strength to conduct multiple material testing evaluations during mass production development. - Measurement of the strength of the resin itself that has been bonded. *For more details, please refer to the PDF document or feel free to contact us.
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■Comparison of bonding strength of Dibond ■Comparison of bonding strength of wire bond ■Comparison of bonding strength of materials Depending on the condition of each object, we will respond after consulting on whether service can be provided. *For more details, please refer to the PDF document or feel free to contact us.*
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For more details, please refer to the PDF document or feel free to contact us.
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We assist those involved in the research and development of semiconductor devices and related materials as their hands and feet in solving problems. (1) Problem-Solving Support Services Research and development itself is the main theme of problem-solving. We leverage our experience from over 10,000 related prototypes to conduct investigations, analyses, and propose experiments. (2) Electronic Component Processing Services Especially for sensors, there are many irregular shapes that are difficult to accommodate with dedicated equipment. In cases of small quantities, investment balance can be an issue that prevents starting. We can propose production with minimal investment based on our experience in prototype support. We also provide support for small quantities until customers establish dedicated lines. (3) Prototype-Related Tool and Equipment Development Services At the beginning of semiconductor-related material development, there is a need to create devices and tools for functional evaluation. In most cases, dedicated evaluation devices exist, but they are multifunctional and expensive. You can utilize our services when a simple device for single-function comparative evaluation is needed in the early stages of development. We have a track record for applications such as sheet-related materials, package resins, encapsulation resins, phosphors, and QDs.
