A completely new vacuum structural material that suppresses outgassing, creating ultra-clean with 0.2% BeCu (0.2% beryllium copper alloy)!
A completely new vacuum structural material, 0.2% BeCu! Traditionally, stainless steel (SUS) has been the standard material for vacuum structures. However, SUS has poor thermal properties and tends to heat up, resulting in significant gas release. In contrast, the 0.2% beryllium copper alloy (BeCu) has excellent thermal properties and, with its special surface treatment, minimizes outgassing to an extreme level, creating an ultra-clean environment! It excels in advanced semiconductor manufacturing and high-precision analysis! If you are struggling with gas release in a vacuum, please try Tokyo Electron's 0.2% BeCu!
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basic information
Technical documentation on 0.2% BeCu.
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Applications/Examples of results
As vacuum chambers, piping, and fittings for vacuum devices, semiconductor manufacturing equipment, and analytical instruments.
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Company information
At Tokyo Electron Limited, we have developed a variety of vacuum gauges and control equipment that boast precision, reliability, and durability through our expertise in electronics and precision machinery. The concept of "vacuum" is a foundational technology for our lives and industries, impacting fields ranging from the IT industry to electronics, food and healthcare, as well as the development of new materials and the manufacturing of essential goods. Therefore, our business is centered on accurately and flexibly responding to the diverse demands of our clients across various fields. For the betterment of modern industry, tomorrow, and the future, we continue our activities today with the hope that our technology and products related to "vacuum" will become a "true sky" that spreads over people's happiness, just like a clear blue sky.
