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  3. Electronic Components and Modules
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  5. High frequency/microwave parts
  6. Wire bond service

Wire bond service

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last updated:Jun 14, 2023

佐用精機製作所
佐用精機製作所
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We can accommodate even from one piece. We offer wire bond services tailored to our customers' needs.

We provide wire bond services tailored to customer needs, from prototyping to mass production. We can offer design and fabrication of fixtures related to wire bonding. 【Features】 ■ We can accommodate wire bond repairs (restoration and strength reinforcement). ■ Our company has a wide variety of equipment fixtures, allowing us to address delays in delivery due to waiting for fixture production and to reduce costs. ■ We also provide assistance with condition setting and advice on fixture proposals. Please feel free to consult with us.

    High frequency/microwave partsLamps and light emitting devicesLED Module
切り抜き ワイヤーボンド

Wire bond service

切り抜き ワイヤーボンド (2).png
切り抜き ワイヤーボンド (2).png
  • Related Link - http://www.sayo.co.jp/

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basic information

■Compatible with gold wire (silver wire) ■Compatible with 20μm, 23μm, 25μm, 30μm, and 50μm

Price range

Please contact us for details

Delivery Time

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Applications/Examples of results

1. Prototype of high-output laser diodes with multiple wire counts 2. Prototype for low impedance measurement experiments such as MMIC (microwave) 3. Experimental prototype for high-speed light-receiving elements 4. Wire bonding prototype for irregular substrates (glass, ceramics, 3D substrates) 5. Wire bonding and reinforcement for difficult-to-bond material substrates

Company information

佐用精機製作所

佐用精機製作所

Electronic Components and Semiconductors

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We assist those involved in the research and development of semiconductor devices and related materials as their hands and feet in solving problems. (1) Problem-Solving Support Services Research and development itself is the main theme of problem-solving. We leverage our experience from over 10,000 related prototypes to conduct investigations, analyses, and propose experiments. (2) Electronic Component Processing Services Especially for sensors, there are many irregular shapes that are difficult to accommodate with dedicated equipment. In cases of small quantities, investment balance can be an issue that prevents starting. We can propose production with minimal investment based on our experience in prototype support. We also provide support for small quantities until customers establish dedicated lines. (3) Prototype-Related Tool and Equipment Development Services At the beginning of semiconductor-related material development, there is a need to create devices and tools for functional evaluation. In most cases, dedicated evaluation devices exist, but they are multifunctional and expensive. You can utilize our services when a simple device for single-function comparative evaluation is needed in the early stages of development. We have a track record for applications such as sheet-related materials, package resins, encapsulation resins, phosphors, and QDs.

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