A collective manufacturing technology suitable for mass production of lightweight, compact, and waterproof electronic components.

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last updated：Sep 04, 2023

シチズン電子

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Mass production technology for compact electronic components with high dustproof and waterproof performance, packaging press parts, LED elements, sensors, ICs, and more with a unique structure!

This is a unique packaging technology that achieves excellent dust and waterproof performance for electronic components. It enables miniaturization, which has been a challenge with traditional lead frame methods. 【Features】 - Dust and Waterproof Performance By sealing the core components with lamination, dustproof and waterproof performance can be achieved. (The IP level varies depending on the selected components and the packaging structure suited for the application.) - Improved Productivity This technology allows for the lamination of a large number of core components at once, followed by dicing to create individual pieces, enabling the production of thousands to tens of thousands of electronic components simultaneously. This significantly enhances productivity compared to traditional lead frame packaging. Additionally, by encapsulating multiple core components in a single product, the added value of the product can also be improved. Furthermore, some optical components can be produced without molds, allowing for shorter lead times. - Miniaturization By replacing the lead frame with a circuit board, the line width can be narrowed to around several tens of micrometers. This also allows for the miniaturization of the components themselves. For example, in our tactile switches, we have achieved a 20% reduction in size compared to conventional products.

Related Link - https://ce.citizen.co.jp/support/product

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■Specifications of electronic components that can be manufactured: - Type: Surface mount - Size: To be discussed - Core components that can be sealed: Metal parts, LED elements, sensor elements, ICs, etc. *Manufacturing of the core components themselves may also be possible depending on specifications. ■Overview of packaging methods: - After placing the core components on the circuit board, laminate them with sheet-like materials. - By laminating a large number of core components at once and then using a dicing saw to separate them, a large quantity of electronic components can be produced at once (in practice, 1,800 electronic components were produced at once). - Dust resistance: Equivalent to IP6X (depends on the selected materials for each package). - Water resistance: Equivalent to IPX7 (depends on the selected materials for each package). - Operating environment (temperature, humidity, light levels, etc.): Depends on the core components. - Reflow compatible depending on the packaging materials.