Satisfying customer needs with a lid that can control heat in various structures.
Our socket lids are available in various types to accommodate all packaging needs, designed with functionality and ease of use in mind to ensure stable contact. Additionally, to meet the heat dissipation requirements of high-power chips, we also offer air-cooled and water-cooled lids, capable of handling up to 1,500W.
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As a leader in the IC test interface industry, our company provides services in various fields such as semiconductors, optics, information technology, and optoelectronics. With advanced knowledge and technology, we are committed to offering competitive prices, high-quality products, appropriate customized designs, timely delivery, and professional services.
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