WinWay Technology Co., Ltd. Product Lineup

E-Flux Extremely High Heat-Flux Thermal Controller E-Flux provides high-temperature/low-temperature testing environments for high-power consumption chips. Through refrigeration cycle technology, it can directly heat/cool the DUT. Temperature: -40 to 150°C Applications: Socket lid/Plunger/Cantilever Scope of application: High power consumption devices / Wide temperature range

• Semiconductor inspection/test equipment
• Temperature and Humidity Control

HEATCon High Efficiency Active Thermal Controller HEATcon is a high-efficiency active solution that controls the test temperature of ICs with a powerful heater and adjustable flow rate (automatic flow control). Temperature: 20–150°C Applications: Socket lid / Plunger / Cantilever / Handler Scope of application: High power consumption devices / High temperature

• Semiconductor inspection/test equipment
• Temperature and Humidity Control

ATC Active Thermal Controller The ATC is an active temperature unit that uses thermoelectric chips to control the test temperature of ICs during characteristic evaluation, circulating fluid as the cooling medium. Temperature: -60 to 150℃ Applications: Socket lid / Plunger / Cantilever / Handler Applicable range: Low power consumption devices / Wide temperature range

• Semiconductor inspection/test equipment
• Temperature and Humidity Control

Test sockets can be fully customized according to customer requirements. Materials, probe structures, plating specifications, and other configurations can be tailored to meet various testing needs, enabling support for a wide range of applications, including high-frequency, high-speed, and wide-temperature-range testing. Currently, chip testing with a minimum pitch of 0.3 mm is supported.

• Semiconductor inspection/test equipment
• Other inspection equipment and devices

It is a fully metal socket, also known as a brownie socket. Optimized impedance control developed with our unique technology minimizes interference between signals and achieves excellent signal transmission. It is capable of supporting high-speed testing required for devices such as AI, HPC, ADAS, VR, and 5G.

• Semiconductor inspection/test equipment
• Other inspection equipment and devices

Our socket lids are available in various types to accommodate all packaging needs, designed with functionality and ease of use in mind to ensure stable contact. Additionally, to meet the heat dissipation requirements of high-power chips, we also offer air-cooled and water-cooled lids, capable of handling up to 1,500W.

• Testing Equipment and Devices
• Semiconductor inspection/test equipment