Mechanical clamp or electrostatic chuck compatible! Sub-nanometer etching mechanism.
The "scia Trim 200" is an ion beam trimming device that controls film thickness etching with high precision and high throughput. It supports wafer substrates up to 200mm, improving yield. Additionally, the process is ion beam trimming (IBT). Please feel free to consult us when needed. 【Features】 ■ Supports wafer substrates up to 200mm ■ Yield improvement ■ Film thickness etching control with high precision and high throughput ■ Compatible with mechanical clamps or electrostatic chucks ■ Sub-nanometer etching mechanism *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Application】 ■ Frequency or film thickness control for SAW and BAW filters ■ Thickness control for SOI, quartz, LT/LT, and bonded substrates ■ Step and film thickness control for TFH ■ Shape correction for MEMS *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Our company website features information on used equipment related to FPD and semiconductors. ● Main Business Activities Purchase of used semiconductor manufacturing equipment, refurbishment, sales, and setup operations Construction and consulting for semiconductor manufacturing lines Purchase of used FPD manufacturing equipment, refurbishment, sales, and setup operations Construction and consulting for FPD manufacturing lines Contract development, manufacturing, and sales of semiconductor manufacturing equipment and FPD manufacturing equipment Sales of various equipment parts Agency sales of overseas manufactured equipment