Non-destructive testing is possible! Introducing an analysis method that detects delamination and other issues based on the propagation time and strength of ultrasound.
Our company offers analysis support services (ultrasonic testing) that are useful for confirming the state of semiconductor device packaging and analyzing defective products. Ultrasonic testing is one method of analysis that detects delamination and other issues based on the propagation time and strength of ultrasonic waves. It can not only determine the presence of delamination but also estimate its location and size. Additionally, in investigating the locations of defects in semiconductor module products, we can conduct non-destructive evaluations of joints and non-destructive internal analyses of modules, including tracking investigations of delamination at the interface between circuit boards and plating layers. 【Service Overview (Excerpt)】 ■ Non-destructive evaluation of joints - Investigation of delamination and voids at semiconductor chip joints - Investigation of voids occurring within encapsulating resin *For more details, please refer to the PDF document or feel free to contact us.
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【Overview of Other Services】 ■Non-destructive internal analysis of modules ・Investigation of delamination at the interface of circuit boards and plating layers *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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We assist those involved in the research and development of semiconductor devices and related materials as their hands and feet in solving problems. (1) Problem-Solving Support Services Research and development itself is the main theme of problem-solving. We leverage our experience from over 10,000 related prototypes to conduct investigations, analyses, and propose experiments. (2) Electronic Component Processing Services Especially for sensors, there are many irregular shapes that are difficult to accommodate with dedicated equipment. In cases of small quantities, investment balance can be an issue that prevents starting. We can propose production with minimal investment based on our experience in prototype support. We also provide support for small quantities until customers establish dedicated lines. (3) Prototype-Related Tool and Equipment Development Services At the beginning of semiconductor-related material development, there is a need to create devices and tools for functional evaluation. In most cases, dedicated evaluation devices exist, but they are multifunctional and expensive. You can utilize our services when a simple device for single-function comparative evaluation is needed in the early stages of development. We have a track record for applications such as sheet-related materials, package resins, encapsulation resins, phosphors, and QDs.