Glass epoxy (Galaepo) molded products
Glass epoxy (Galaepo) cutting process
Die cutting of galepoxy using a compound-type mold.
Glass epoxy resin laminated sheets excel in insulation, moisture resistance, mechanical strength, and dimensional stability, making them suitable for applications such as FPC reinforcement plates, various device components, and insulating boards. Additionally, there are general types (G-10) and flame-retardant types (FR-4) available depending on the usage environment. Myojo Electric has extensive experience in the die-cutting of glass epoxy laminated sheets. Although the initial cost of mold production for die pressing is high, the processing cost is low, which helps keep running costs down, making it suitable for medium to large lots. Compound die processing allows for simultaneous cutting of the product's outer shape and holes, resulting in good product accuracy and flatness, with the advantage of having the same direction for burrs on the outer shape and holes. This case study illustrates die-cutting using a compound die. The finished product has been well-crafted, minimizing burrs generated during pressing through surface smoothing by double-sided polishing and powder removal. Recently, inquiries related to automotive applications have increased, and the requirements for processing and precision have become stricter. In addition to combining pressing and NC machining to accommodate a wide variety of processing needs, we also address whitening of the outer shape and reduction of burrs through multiple shaving processes. If you have any interest or inquiries, please feel free to contact us.
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basic information
【Material Sales】 ○ Thermosetting resin laminated boards and molded boards ○ Thermosetting resin laminated round bars and pipes ○ Insulation boards ○ Thermoplastic resins and general-purpose plastics ○ Engineering plastics ○ Super engineering plastics ○ Copper-clad laminated boards ○ Adhesive and bonding tapes ○ Functional films ○ FPC materials 【Processing and Manufacturing】 ○ Precision punching processing (various laminated boards, plastic sheets, ultra-thin metal sheets) ○ Precision die-cutting of adhesive tapes and films ○ Precision cutting processing ○ Functional film laminating processing ○ Optical film curved surface vacuum laminating processing ○ Contract development of jigs and devices ● For more details, please contact us or download the catalog.
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Company information
Seiko Electric Co., Ltd. was founded in 1947, shortly after the war. Initially, we only sold insulating materials, but in response to customer requests, we began to offer processing services such as cutting, bending, and laminating. By utilizing our sales and production bases both domestically and internationally, we have been able to provide comprehensive support for our customers' businesses through services ranging from material sales to planning, proposals, processing, and logistics. We continuously challenge ourselves with new technologies in various fields, including smartphones, tablets, display devices, automotive parts, robots, measuring instruments, wearable devices, medical equipment, aerospace, manufacturing equipment, and power electronics, responding to customer needs from material sales to resin processing, tape and film processing, and vacuum lamination processing. Additionally, leveraging our global network for sourcing materials from overseas and supplying materials to overseas factories, we support all phases of "manufacturing," from material procurement to prototyping and mass production, including proposals for transitioning to mass production at our factory in the Philippines after prototyping and small-lot production at our Shirakawa factory.
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