Button-plated FPC that enables high-speed transmission, ultra-thinness, and flexibility in a new dimension.
Button-plated flexible printed circuit boards (FPC) can utilize the original thickness and characteristics of copper foil by applying through-hole plating only to the through-holes and through-hole lands. This allows for uniform maintenance of conductor thickness, enabling the formation of high-precision wiring, which is expected to provide high-accuracy impedance control, making it ideal for high-speed transmission applications. Compared to conventional panel plating methods, button-plated FPCs excel in flexibility and bendability, achieving ultra-thin designs. This enables the lightweight and compact design of products. The new method also allows for button plating on narrow pitch patterns. Product Features: 1. By applying copper plating only to the through-holes, the original characteristics of the copper foil are maximized. 2. High-precision impedance control is possible, demonstrating performance suitable for high-speed transmission. 3. Compared to panel plating methods, it excels in flexibility and bendability while achieving ultra-thin designs. 4. It provides stable quality with technology that has cleared reliability evaluations based on JISC5016. 5. Through-hole plating is possible even for narrow pitch patterns, which were previously difficult to achieve.
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basic information
Product Specification Example Through Hole Diameter: φ100μm Land Diameter: φ300μm Button Plating Diameter: φ240μm Button Plating Thickness: 15μm to 25μm Base Material: Polyimide: 25μm, 50μm Liquid Crystal Polymer: 50μm Base Material Copper Foil Thickness: 12μm, 18μm
Price range
P4
Delivery Time
P4
※The delivery date may vary depending on the specifications. Please contact us for more details.
Applications/Examples of results
[Examples of Achievements] Flexible Printed Circuit Boards (FPC) for Optical Communication Flexible Printed Circuit Boards (FPC) for Medical Devices
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Company information
We are committed to contributing to daily life, society, and industry through value creation driven by materials, technology, and speed (short delivery times) as our motto. FPC can be extremely thin and flexible, allowing it to be used in even the smallest spaces. Therefore, it is utilized in various fields such as smartphones, communication devices, medical equipment, eco-cars like EVs/HVs/FCVs, autonomous driving systems, and VR/AR devices. One of our features is our ability to respond to short delivery times, with the shortest possible delivery being available from the "one-and-a-half-day course." Recently, we developed the "BigElec" FPC, which supports high current. It can be used as a substitute for busbars and harnesses, and we have also obtained a patent for it. We are dedicated to listening sincerely to the needs of our customers and society to develop and create new products, while prioritizing safety and consistently delivering high-quality products. This integrated approach strengthens our foundation for growth and maximizes corporate value. We are building a solid foothold in the ever-changing global market and are striving for continuous growth and development. Please feel free to consult with us.
![Long-length multi-layer flexible substrate [Substrate manufacturing achievements]](https://image.mono.ipros.com/public/product/image/857/2000674579/IPROS01080264647980196626.png?w=280&h=280)
