Using cutting-edge optical application technology! A lineup including inline bump inspection equipment.
This catalog introduces inspection equipment that meets our customers' needs. We feature the "TVI Series," which achieves three-dimensional measurement that follows the state of the circuit board storage in a unique way, and the "CVI Series," which enables high-speed individual board inspection while maintaining high-precision inspection performance. Our products utilize a unique confocal optical sensor, achieving high speed that allows for inline measurement by reducing measurement time. 【Contents Included】 ■ In-tray type inline bump inspection equipment ■ Index type inline bump inspection equipment ■ Inline bump inspection equipment ■ Temperature-variable warpage inspection equipment ■ Multi-beam confocal sensor ■ Three-dimensional sensor specifications *For more details, please refer to the PDF document or feel free to contact us.
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【Featured Products (Excerpt)】 ■TVI-S7040-RA ■CVI-S10210 ■EVI-S10210-RA ■HVI-S10000C ■SCS-7040R2 ■SCS-7550R2 *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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At Toko Takadake, we handle a unique confocal optical system sensor. The three-dimensional measurement sensor "NCS/SCS series" is based on the confocal method, known for its high-precision measurement technique. We have shortened the measurement time, which was a problem with the confocal method, using our unique approach, achieving high speed that enables inline measurement. This high-precision and high-speed three-dimensional measurement method, which did not exist before, is widely used, particularly for bump inspection. Our company offers inspection equipment with high cost performance using advanced optical application technology to meet our customers' needs.
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