Diamond-coated wire saw! Even slight changes can have a significant impact on functionality.
We would like to introduce our wafer process "slicing" in semiconductor manufacturing. Cylindrical or rectangular ingots are sliced into uniform wafers using a diamond-coated wire saw. The Dublin rotating union cools the guide rollers to keep the cuts smooth and straight. 【Features】 ■ Slicing into uniform wafers ■ Cooling of guide rollers *For more details, please refer to the related links or feel free to contact us.
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Since our establishment in 1945, we have maintained the philosophy of providing our customers with the best products as a dedicated manufacturer of rotary joints. In recent years, we have also created unique products based on our original design concepts in slip rings, which facilitate the exchange of electrical signals, data, and power in rotating bodies. To realize our customers' visions, we will propose strong solutions through our skilled engineering team and modern manufacturing facilities. We will provide the best products that truly satisfy our users. We have launched a Japanese website. https://www.deublin.com/ja-JP/