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  6. Wafers Process Polishing

Wafers Process Polishing

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last updated:Sep 04, 2023

デュブリン・ジャパン・リミテッド 本社
デュブリン・ジャパン・リミテッド 本社
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Final polishing is done with a mirror finish! It is made using a machine that uses Dublin.

We would like to introduce our wafer process "Polishing" in semiconductor manufacturing. Final polishing removes fine defects remaining on the wafer surface and provides a mirror finish on the surface where the chip will be mounted. The Dublin rotary union controls the pressure and temperature of the polishing process. Please feel free to contact us if you have any inquiries. 【Features】 ■ Removes fine defects remaining on the wafer surface ■ Provides a mirror finish on the surface where the chip will be mounted ■ Controls the pressure and temperature of the polishing process *For more details, please refer to the related links or feel free to contact us.

    Other semiconductors
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Wafers Process Polishing

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  • Related Link - https://www.deublin.com/ja-JP/Industries/Semicondu…

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デュブリン・ジャパン・リミテッド

デュブリン・ジャパン・リミテッド 本社

Machine elements and parts

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Since our establishment in 1945, we have maintained the philosophy of providing our customers with the best products as a dedicated manufacturer of rotary joints. In recent years, we have also created unique products based on our original design concepts in slip rings, which facilitate the exchange of electrical signals, data, and power in rotating bodies. To realize our customers' visions, we will propose strong solutions through our skilled engineering team and modern manufacturing facilities. We will provide the best products that truly satisfy our users. We have launched a Japanese website. https://www.deublin.com/ja-JP/

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