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  6. Thermal measures during material bonding and joining, and CAM bonding suitable for laminated bonding and joining.

Thermal measures during material bonding and joining, and CAM bonding suitable for laminated bonding and joining.

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last updated:Sep 13, 2023

輝創 輝創株式会社
輝創 輝創株式会社
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Are you having trouble with heat dissipation improvement during component bonding or with adhesion and joining when laminating metals?

CAM joining is a joining technology that utilizes two joining mechanisms, "Chemical & Melting," to bond materials. It resembles an adhesive but is not an adhesive. The joining targets can include a wide range of materials, such as metal-plastic and dissimilar metals. CAM joining is an environmentally friendly technology that allows for easy construction and cost reduction, and it can be designed to have various functions depending on the joining purpose.

    DC Motor
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Thermal measures during material bonding and joining, and CAM bonding suitable for laminated bonding and joining.

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basic information

Functional characteristics of CAM bonding include: - Capability for metal-resin bonding - Capability for metal-metal bonding including dissimilar metals - Applicable to most metals that undergo surface oxidation - Bonding possible using organic thin films, with low consumption - Capability for zero thermal resistance bonding - High heat resistance of over 150°C - CAM agents are water-soluble bonding materials but can be bonded after drying - Options for conductivity and insulation These features provide a variety of functional characteristics.

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CAM bonding is suitable for heat sink applications that can take advantage of low thermal resistance and for the laminated bonding of thin metal sheets.

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輝創

輝創 輝創株式会社

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Our company is engaged in the development of joining technologies. The newly developed CAM joining can handle a range of applications, starting from the joining of dissimilar materials such as metal and resin, to metal-metal joining that includes dissimilar metals. CAM joining can achieve zero thermal resistance and is also applicable to the laminated joining of multilayer thin plates.

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