Diode Module DCA200/240DB・DCA240EB

Revamping the internal structure for the purpose of heat dissipation (improving long-term reliability) and weight reduction.

**Features** High heat dissipation (low thermal resistance) achieved through a low-layer structure, combined with the synergistic effect of solder bonding on both sides of the chip, enhances long-term reliability. Additionally, weight reduction is realized through optimization of internal design and materials. ● DCA200/240DB High Heat Dissipation (High Reliability) Model Improved heat dissipation due to a newly designed low-layer structure. By significantly reducing thermal stress on the chip, it achieves approximately twice the power cycle endurance compared to conventional products from SanRex, contributing to the reliability of the device. ● DCA200DB220 High Heat Dissipation and High Voltage Model In addition to high reliability, it adopts a specially developed glass passivation type high voltage chip that supports 2200V. It can be used in regions where the power supply voltage exceeds AC500V. ● DCA240EB Ultra High Heat Dissipation Model In addition to the newly designed low-layer structure, it employs a special material with even higher heat dissipation for the internal insulation layer, allowing for a more relaxed thermal design.

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