It is possible to attach multiple substrates with varying thicknesses based on the back surface.
The "HMS-400P" is a bonding device designed to adhere thin substrates to support substrates (adhesive plates) made of materials such as ceramic or quartz using wax adhesive. During the bonding process, vacuum degassing is performed, and the bonding pressure is applied using a diaphragm method (airbag) through air pressure from the upper cover. Cooling can be controlled for temperature rise and fall times using indirect water cooling. 【Specifications】 ■ Target support substrate: Maximum outer diameter Φ400mm × 20mm thick ■ Bonding temperature setting range: Room temperature to 200℃ ■ Bonding method: Air pressure (diaphragm airbag method) ■ Vacuum method: Vacuum pump (external) ■ Cooling method: Cooling water (indirect water cooling), etc. *For more details, please download the PDF or feel free to contact us.
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【Other Specifications】 ■Control Method: Sequencer + PID Temperature Control ■Main Body Size: W600×D1000×H1750 ■Weight: Approximately 700kg *For more details, please download the PDF or feel free to contact us.
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Our company is made up of engineers who are well-versed in lap and polish machines for polishing compound semiconductors such as sapphire and SiC. We aim to strengthen our research and development system for polishing machines and consumable materials to meet customer needs, providing safe, high-quality, and low-cost technologies and products. Please feel free to contact us if you have any inquiries.