ハイテクノス Product Lineup

The "HMS-400P" is a bonding device designed to adhere thin substrates to support substrates (adhesive plates) made of materials such as ceramic or quartz using wax adhesive. During the bonding process, vacuum degassing is performed, and the bonding pressure is applied using a diaphragm method (airbag) through air pressure from the upper cover. Cooling can be controlled for temperature rise and fall times using indirect water cooling. 【Specifications】 ■ Target support substrate: Maximum outer diameter Φ400mm × 20mm thick ■ Bonding temperature setting range: Room temperature to 200℃ ■ Bonding method: Air pressure (diaphragm airbag method) ■ Vacuum method: Vacuum pump (external) ■ Cooling method: Cooling water (indirect water cooling), etc. *For more details, please download the PDF or feel free to contact us.

• Circuit board processing machine

The "HIT-36L-3R" is a one-sided lap grinding machine that excels in operability and maintainability. It employs a mechanism that allows for the easy attachment and detachment of the base plate using a center bolt, making it simple to replace and clean the base plate. Additionally, by adopting an optional forced drive and oscillating drive mechanism, it enables stable rotation of the workpiece, stable management of the base plate's flatness, and improvement of the workpiece's flatness. 【Table Specifications】 ■ Target Workpiece: Maximum outer diameter of approximately Φ350mm ■ Usable Table Diameter: Φ910mm without water cooling mechanism ■ Processing Axis: 3-row revolving guide rollers ■ Table Rotation Electric Motor: AC200V 3-phase 2.2kw inverter motor ■ Table Rotation Speed: Stepless variable speed 10 to 60 rpm, etc. *For more details, please download the PDF or feel free to contact us.

• Wafer processing/polishing equipment