[Example] Wire bonding and flip chip mixed assembly of optical devices.

Speeding up the communication speed of optical communication modules! A project with many necessary technical elements.

We would like to introduce a case study of wire bonding and flip chip hybrid mounting of optical devices (VCSEL chips). We received an inquiry about creating a module that incorporates optical waveguides within a flexible substrate and delivers optical signals from the light-emitting and receiving devices mounted on the substrate to a connector directly connected to the substrate. We visited a partner company with a high-performance mounter to oversee the assembly and set conditions, confirming the state after position-specific mounting. We were able to manufacture an optical communication module that meets the customer's required specifications. [Case Overview (Partial)] ■ Mounting Method - Wire Bonding = Wire Bonder - IC Mounting = Flip Chip Bonder - Resin Sealing = Manual Dispenser *For more details, please refer to the PDF document or feel free to contact us.

Other optical parts