Supports plate thickness up to 4.8t! We can achieve permanent hole filling for Via according to customer requests.
We offer "Pad on Via (permanent filling)" services. We support the manufacturing of pad on vias in the BGA and CSP areas. The filling of pad on vias can accommodate board thicknesses up to 4.8t. Additionally, the permanent filling ink is processed smoothly through polishing, allowing us to achieve permanent filling of vias according to customer requests. 【Features】 ■ Supports the manufacturing of pad on vias in the BGA and CSP areas ■ Filling of pad on vias can accommodate board thicknesses up to 4.8t ■ Achieves permanent filling of vias according to customer requests ■ Permanent filling ink is processed smoothly through polishing *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications (Partial)】 ■ Board Thickness - Selectable: 0.4t or more and 4.8t or less - All Vias: 0.4t or more and 2.0t or less ■ Drill Diameter: φ0.105mm to φ1.0mm or less (subject to consultation based on specifications) *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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The screen process strives to meet various customer needs by pursuing high quality, high precision, and short delivery times, while also accurately responding to the demand for lower prices. Furthermore, we aim to deliver products that anticipate future directions and contribute to a prosperous future.