Achieving significant reduction in takt time and fine dispensing! Ultra-precision dispenser.

Significantly reduce tact time with continuous dispensing! The ultra-precision dispenser device 'Quspa-LX' enables high-precision fine dispensing.

A new model of our ultra-precision dispenser device series 'Quspa', widely adopted in substrate mounting and underfill processes in semiconductors, has been released. It demonstrates excellent positional accuracy even during high-speed continuous dispensing, reducing the tact time by up to approximately 50% compared to conventional stop-and-go application (theoretical value). This contributes to improved productivity. *Compared to our conventional models. It also achieves high-precision solder jet application within a diameter of ±20μm. It is compatible with various dispensing materials, including epoxy thermosetting resins, cream solder, and silicone-based thermosetting resins. [Features] ■ Achieves astonishing miniaturization: Cream solder at 110μm, epoxy thermosetting resin at 80μm, UV adhesive at 100μm, etc. ■ Improved dynamic positional accuracy: Application position accuracy within 3σ10μm (during non-stop jet application). ■ High-speed network: Network processing speed improved by 16 times (theoretical value). ■ Tact time reduction: Significant reduction in tact time due to improved processing speed. ■ GUI iconization: Intuitive screen operation possible. ■ Supports more workpieces: Standard equipped with coaxial displacement sensors. *For more details, please download the materials or contact us.

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