The inner layer copper foil thickness can use 1/2 oz (18 μm) and in some cases 1 oz (35 μm)!
We would like to introduce our "100-layer Ultra High Multi-layer Printed Circuit Board Manufacturing Technology." Through high-precision lamination technology using ultra-thin materials, we have achieved high multi-layer printed circuit boards with over 100 layers, utilizing core materials of 30μm and prepreg of 20μm, resulting in a board thickness of 7.6mm for a 110-layer board. Additionally, our high-precision lamination technology allows us to accommodate narrow pitch specifications with a 0.5mm pitch. Please feel free to contact us if you have any inquiries. 【Features】 ■ Achieved a 110-layer board with a thickness of 7.6mm by using core materials of 30μm and prepreg of 20μm ■ Inner layer copper foil thickness can be 1/2oz (18μm) and in some cases, 1oz (35μm) can be used ■ Capable of accommodating narrow pitch specifications with a 0.5mm pitch due to high-precision lamination technology *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Overview】 ■110-layer substrate ・Thickness: 7.6mm ・Hole pitch: 0.5mm ・Inner layer copper foil thickness: 1oz and 1/2oz *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Examples of Application】 ■ Semiconductor tester substrates, load boards, socket boards, probe cards, etc. *For more details, please refer to the PDF document or feel free to contact us.
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Company information
OKI Circuit Technology Co., Ltd. is a manufacturer engaged in the development, design, and production of printed circuit boards, electronic devices, and substrate mounting of electronic components. With a consistent system from pattern design/simulation to manufacturing, we deliver printed circuit boards with specific functions added for various applications, such as controlled characteristic impedance, heat dissipation measures, build-up, changes in inner layer copper foil thickness for high current, high-frequency compatibility, and noise countermeasures, all within short delivery times. With many years of development and manufacturing experience, we have a strong track record in the fields of aerospace and defense equipment, transportation infrastructure equipment, high-end communication and measurement devices, semiconductor testing equipment, industrial equipment, and medical devices. We respond to a wide variety of outsourcing needs. For any inquiries regarding mounting substrates or printed circuit boards, please feel free to contact us.