Knowledge of plating: The mechanism of electroplating

In addition to the mechanism of electroplating, the characteristics of reduction reactions and electroplating are also explained!

Electroplating is a process in which the item to be plated is used as the cathode (negative electrode) and the metal to be plated is used as the anode (positive electrode) in an electrolytic solution containing metal ions. The mechanism of electroplating involves a reduction reaction occurring at the cathode, where metal is deposited and grows as a plating film. The reduction reaction refers to the process at the surface of the cathode (the product to be plated), where metal ions in the plating solution (the state in which the metal is dissolved in the plating solution) are converted into metal (losing charge) by direct current (electrons). Conversely, an oxidation reaction occurs at the anode, where metal dissolves into the plating solution and becomes metal ions. These two reactions occur simultaneously at the cathode and anode. *For more detailed information, please refer to the related links. Feel free to contact us for further inquiries.*

Plating Equipment