Exhibiting new equipment at Tokyo Big Sight! A reflow oven that significantly extends the frequency of in-furnace cleaning and a selective soldering machine with new features, among others.
Koki Tech Co., Ltd. will be exhibiting at the "38th Internepcon Japan Electronics Manufacturing and Packaging Exhibition" held at Tokyo Big Sight. The exhibition will take place over three days from January 24 (Wednesday) to January 26 (Friday), 2024, and our booth will be located at "East 1E4-48." We will showcase equipment such as the far-infrared combined hot air circulation reflow oven "VFR-408N" and the inline selective soldering machine "SELBOIII." 【Event Overview】 ■ Date: January 24 (Wednesday) to January 26 (Friday), 2024 ■ Venue: Tokyo Big Sight ■ Booth Number: East 1E4-48 *For more details, please refer to the PDF document or feel free to contact us.
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【Exhibition Equipment】 ■ Far Infrared Combined Hot Air Circulation Reflow Oven "VFR-408N" - 2WAY (Far Infrared & Hot Air/Warm Air) heating method - Special far infrared panel heater & hot air circulation method ■ Inline Selective Soldering Machine "SELBOIII" - Labor-saving and automation in inline configuration - Additional modules can be added according to production volume ■ Desktop Selective Spray Device "ULTIMA-SPZ" - High-efficiency flux application under optimal conditions ■ ULTIMA Series CE - Sales strategy for the "TakuROBO" brand in Europe and the U.S. with CE certification - Target models: ULTIMA-SPZ/PHS/TRZ *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."