The Slice & View feature of FIB allows you to observe the spread from the starting point of plating defects, and the 3D construction enables confirmation of the shape of the defects.
The focused ion beam (FIB) device irradiates a focused ion beam onto a sample for processing and observation. Additionally, the FIB-SEM is equipped with a high-resolution FE-SEM (field emission scanning electron microscope), which allows for simultaneous high-resolution observation and processing. This video demonstrates the observation of "plating defects" using the Slice & View and 3D construction functions of the FIB-SEM (Thermo Fisher Scientific: Helios5 CX). For more details, please watch the video.
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basic information
The FIB's Slice & View allows us to observe how defects spread from their origin, and the 3D construction enables us to confirm the shape of the defects. For more details, please watch the video.
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This technology can also be applied to other fields such as semiconductor defect analysis and material condition assessment, so please feel free to contact us.
Company information
Seiko Future Creation Co., Ltd. conducts business centered on contract analysis services, research and development, production technology, and FA systems, providing various services aimed at solving customer challenges. Regarding contract analysis, we have a proven track record of solving issues in the development, manufacturing, and quality assurance processes within the Seiko Group, allowing us to respond comprehensively by anticipating the background in various situations. We can handle samples ranging from million-order to nano-order sizes based on our extensive analytical experience primarily in watches and ICs, as well as in printer-related fields. In particular, we tackle customer challenges "from multiple perspectives and comprehensively" using the following technologies: - Microfabrication using a focused ion beam (FIB) device - Thermal analysis of material properties using differential scanning calorimetry (DSC) and others - Observation of microstructure using scanning probe microscopy (AFM) and others - Surface analysis using various devices (XPS, AES, GD-OES) - Cross-sectional observation and structural analysis using various devices (SEM, TEM) Our engineers are available for direct consultations. If you have any concerns, please feel free to reach out to us. *Seiko Future Creation Co., Ltd. changed its name from Seiko I-Techno Research Co., Ltd. on July 1, 2022.
