The ideal small plasma CVD device for research and prototyping: 'VC-R400F'
VC-R400F
Adopting a unique LIA method plasma source, we achieve ultra-fast, high-quality vacuum deposition on resin films and metal foils!
The "VC-R400F" is a plasma CVD device that employs a unique LIA (Low Inductance Antenna) method plasma source, enabling ultra-fast and high-quality vacuum film deposition on resin films and metal foils. It is well-suited for experiments, research, evaluation, and prototyping. By using the LIA method of inductively coupled plasma (LIA-ICP), it achieves fast, high-precision, and low-damage vacuum film deposition. With multi-point control, it ensures finer uniformity. It offers a variety of manual, automatic, and optional features. 【Features】 ■ Well-suited for experiments, research, evaluation, and prototyping ■ Achieves fast, high-precision, and low-damage vacuum film deposition ■ Ensures finer uniformity through multi-point control of LIA ■ Realizes ultra-fast film deposition more than five times compared to conventional methods ■ A wide range of options available *For more details, please refer to the related links or feel free to contact us.
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basic information
■ Target substrate: Resin film (PET, PEN), metal foil 【Specifications (partial)】 - Target films: DLC, SiN, SiO, etc. - Film formation method: Deposition down, stationary film formation (inline film formation also available) - Temperature control: Stage temperature control < 500℃ *For more details, please refer to the related links or feel free to contact us.
Applications/Examples of results
【Applications】 ■DLC ■Functional film ■Surface modification ■Surface treatment ■Etching ■Ashing *For more details, please refer to the related links or feel free to contact us.
Line up(1)
Model number | overview |
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VC-R400F | ・Target substrates: resin films (PET, PEN), metal foils |
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