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  6. Burn-in device (for devices, chips, and components)

Burn-in device (for devices, chips, and components)

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last updated:Feb 12, 2025

Semi Next 本社、三重事業所
Semi Next 本社、三重事業所
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Significant increase in production efficiency! You can freely set burn-in conditions for each jig, making it convenient for research and development.

Our company's "Burn-in Equipment" is not chamber-based, but allows for temperature and power conditions to be controlled for each jig, making it user-friendly. 【Features】 ■ Simultaneous burn-in of up to 4224 devices per system ■ Temperature and power conditions can be controlled for each jig ■ Dedicated jigs support wire bonding, loaders, burn-in, unloaders, and inspection *For more details, please refer to the PDF materials or feel free to contact us.

    Other inspection equipment and devices
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Burn-in device (for devices, chips, and components)

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  • Related Link - https://en.semight.com/

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Semi

Semi Next 本社、三重事業所

Electronic Components and Semiconductors

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We are a global supplier of advanced testing and measurement equipment. We provide high-performance and highly integrated measurement solutions that can support everything from research and development to mass production processes in cutting-edge fields such as high-speed communication, optical chips, electronic measurement, and power semiconductors. Since our founding, we have placed "Dedication and Craftsmanship" at the core of our corporate values, pursuing product development that combines deep insights into measurement principles with a spirit of craftsmanship. Aiming to be "the best testing solution company supporting global technological innovation," we will continue to provide high-performance, high-efficiency, and highly reliable solutions to address global industrial challenges.

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