Adopted in many products such as communication devices! Printed circuit boards that enable thinner substrates.
We would like to introduce the "Any Layer PCB" handled by Matsuwa Sangyo Co., Ltd. It has a slightly different structure from build-up PCBs, utilizing laser vias even in the inner core section, enabling the thinning of the PCB through full-layer laser vias and filled via plating. The freedom of wiring has further increased, and it is adopted in many products such as IoT devices, wearable products, and communication equipment (5G). 【Any Layer PCB Manufacturing Specifications Example】 ■ 6-layer 2-2-2 build-up PCB with 0.3mm pitch BGA - Board thickness: t0.6mm - BGA pad diameter: φ0.24mm - Resist opening: φ0.17mm - Laser hole diameter: φ0.1mm *For more details, please refer to the related links or feel free to contact us.
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Our entire staff takes responsibility and consistently manufactures all processes of printed circuit board production in our own factory, enabling us to respond to short delivery times that others cannot achieve. We provide a wide variety of printed circuit boards, from single-sided to high multilayer, for applications such as musical instruments, toilets, mobile phones, automotive, and space development. We possess state-of-the-art equipment and can also accommodate short delivery times for high-difficulty boards and flexible boards. Our motto is "Change & Challenge." We are not afraid of transformation and will continue to challenge ourselves! Please feel free to contact us with your requests. Remote face-to-face meetings are also possible!
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