Capable of handling small-scale processing. Reduces implementation area and contributes to product miniaturization. Accurate, quick, and reasonable.
Our company has a proven track record in semiconductor manufacturing and is engaged in assembly processing of semiconductors, including 'Au stud bump processing,' based on the technology cultivated through integrated circuit manufacturing. We have established a processing system that is accurate, high-quality, speedy, and reasonably priced, allowing us to accommodate small quantities after determining conditions tailored to specifications and applications. 【Features】 ■ The mounting area can be minimized, enabling product miniaturization. ■ Processing of extremely small diameters of 25μm is possible. ■ Fine processing with a bump pitch of 28μm is achievable. *We are currently offering materials that introduce the mechanism of bump processing. Please check it out from "PDF Download." Feel free to contact us as well.
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basic information
Overview of Bump Processing Mechanism Introduction Materials ◎ Standard (Tearing Bump) ◎ Leveling (Crushing Bump) ◎ Tamping (Crushing Bump) This document introduces the methods of each processing type. Please view it from "PDF Download."
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For more details, please refer to the PDF document or feel free to contact us.
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Hakodate Electronics Co., Ltd. is engaged in semiconductor assembly and LED testing, focusing on gold stud bump processing. We have established a consistent line for semiconductor back-end processes and an LED probe inspection sorting line, maintaining quality in an environment with temperature and humidity control and measures against electrostatic discharge. We cater to a wide range of needs from development prototypes to mass production, so please feel free to consult with us.
![[Contract Assembly and Processing of Semiconductors] Au Stud Bump](https://image.mono.ipros.com/public/product/image/d73/2000921993/IPROS58969494592555222590.png?w=280&h=280)
