Equipped with loader/unloader! Targeting inline processes after soldering and multi-product production, etc.
The "S-WAVE FBA Series" is a product designed to suppress solder balls during low-temperature soldering at 250°C. It allows for non-contact tool changes that are unnecessary for an extended period. It is applicable to general through-hole mounting of electronic components, terminals with insufficient solder, and areas with heat-sensitive components or surrounding parts. Additionally, the use of solder wire supply reduces solder material consumption, and the power consumption during soldering is less than 300W. 【Features】 ■ Suppresses solder balls during low-temperature soldering at 250°C ■ Non-contact tool changes are unnecessary for an extended period ■ Daily maintenance is automated with a temperature checker/cleaning device (optional) ■ Reduces solder material consumption through solder wire supply ■ Power consumption is less than 300W (during soldering) *For more details, please refer to the PDF document or feel free to contact us.
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【Target】 ■ General through-hole mounting of electronic components ■ Terminals with insufficient soldering ■ Terminals with narrow pitches, such as connectors and LCD panels ■ Areas with heat-sensitive components or surrounding parts ■ Inline processes for post-soldering and multi-variety production *For more details, please refer to the PDF document or feel free to contact us.
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【Applicable Fields】 ■ Electric vehicles, renewable energy, information communication, air conditioning *For more details, please refer to the PDF document or feel free to contact us.
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