Achieved miniaturization with dimensions of 10mm × 38mm! It is also possible to check images in 3D.
We would like to introduce a development case of our "Dual Image Sensor Equipped Compact Camera Head Board." This board achieves miniaturization with external dimensions of 10mm x 38mm while incorporating two image sensors and two LVDS Tx. The substrate uses FPC. Additionally, since it is equipped with LVDS Tx, it is possible to maintain a distance of over 550mm to the CCU (Camera Control Unit). 【Case Overview】 ■ Developed Product: Dual Image Sensor Equipped Compact Camera Head Board ■ Development Details - Achieved miniaturization with external dimensions of 10mm x 38mm while incorporating two image sensors and two LVDS Tx. *For more details, please refer to the related links or feel free to contact us.
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● Image Giken assists customers with their development. We provide extensive support for customer development across hardware, FPGA, firmware, and software. If you provide us with a product concept, we can deliver a working prototype. For small lots, mass production supply is also possible. ● Image Giken is an expert in images. Through the development of various cameras and image sensor application devices, we have accumulated know-how in image signal processing. We have also quickly tackled and realized advanced interfaces such as USB 3.0, 3G-SDI (3D format compatible), MIPI (CSI-2 / DSI), and SLVS-EC Ver2.0. By using hardware processing with FPGA, we achieve high-speed processing and real-time processing. We implement real-time noise reduction processing for a 1.3 million pixel 2000fps CMOS image sensor. Additionally, we provide functions such as labeling engines as FPGA IP.
