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Heat dissipation silicone

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last updated:Feb 24, 2026

安達新産業 本社
安達新産業 本社
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We propose silicone adhesives, potting materials, and encapsulants that can also be used for conventional general-purpose devices requiring heat dissipation.

Adachi New Industry, as a distributor for Momentive, offers various silicone solutions for thermal management. 【1】Thermal Gap Filler Exhibiting thermal conductivity, it contributes to the long-term reliability of devices that generate heat. It is liquid and can be automatically applied using a dispenser. This silicone is ideal for customers facing issues with stress relief and thermal control. 【2】Thermal Silicone Adhesive With excellent thermal conductivity and physical/chemical stability, it allows for thin film application, effectively reducing thermal resistance. It is optimal as a thermal interface adjacent to heating elements, heat spreaders, and heat sinks. 【3】Thermal Potting Compound Silicone sealants exhibit thermal conductivity and contribute to the long-term reliability of devices that generate heat. We offer a range of materials that cure into soft rubber or gel-like forms, including low to medium viscosity products suitable for potting applications. 【4】Thermal Silicone Grease Exhibiting thermal conductivity, it contributes to the long-term reliability of devices that generate heat. Its ability to be applied as a thin film significantly reduces thermal resistance.

    RubberOther polymer materials
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Heat dissipation silicone

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  • Related Link - https://www.ad-chemi.com/product-information/cat/u…

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Proposal for Silicone from Adachi New Industry Co., Ltd. [1] Advice for Appropriate Selection We will carry out selection based on your applications and objectives. Even if the product is not currently in our lineup, we will coordinate with Momentive to inform you about the feasibility of accommodating your request. [2] Flexible Inventory Management System to Respond to Demand Fluctuations Many silicone products require lead time, making it difficult to respond to sudden demand. By understanding your demand situation, we can manage inventory of necessary products in advance and deliver them when needed. [3] Support for Refrigerated Goods and Hazardous Materials We collaborate with logistics warehouses that have refrigerated storage capable of temperature management (5-20°C), allowing us to handle a variety of temperature management including normal temperature ranges. Additionally, we have many products that fall under the category of hazardous materials (Class 4). We partner with the largest hazardous materials warehouse in Western Japan to provide comprehensive inventory management, including first-in-first-out, lot management, and traceability. However, please note that separate discussions will be necessary for operations. Feel free to contact us.

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It may vary depending on specifications and usage.

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Applications/Examples of results

◆ Automotive (On-board and Electrical Components) Related Applications Inverter / ECU / EPS OBC (On-board Charger / On-board Charging Device) DC/DC Converter, Electric Compressor Alternator ◆ Communication Communication Base Stations ◆ Devices MPU, CPU for PCs and Servers Game Consoles Smartphones Power Converters

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Heat-dissipating silicone adhesive - Momentive Performance Materials Japan LLC

Heat-dissipating silicone adhesive - Momentive Performance Materials Japan LLC

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News about this product(27)

Added 'Comparison of Non-Fluid Silicone' to AD-Chemi.

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In the assembly process of electronic devices and automotive parts, the "dripping and flowing" of adhesives has been a long-standing concern in the field. When fixing components on a substrate, the applied adhesive may flow into adjacent circuits, or when applied on inclined or vertical surfaces, it may drip before curing—many engineers have likely experienced such issues. One approach to fundamentally solve these problems is the adoption of non-flowing (non-sag) silicone adhesives. After organizing the meaning of the non-flowing viscosity characteristics and the technical background, we will compare the characteristics of three representative products offered by Momentive—TN8000, TSE3925, and TN5015—based on their TDS, and provide guidelines for selection based on application. 1. Organizing the viscosity classification of silicone adhesives 2. Typical application scenarios where non-flowing properties are required 3. Comparing three non-flowing silicone adhesives from Momentive 4. Points for product selection—Which product should you choose? For more details, please visit our website.

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We have added the silicone adhesive and sealant "TSE398" to AD-Chemi.

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The Momentive product "TSE398" is a one-component, fast-curing, non-corrosive silicone adhesive sealant that cures with moisture in the air. After curing, it forms an elastic silicone rubber and exhibits excellent adhesion to copper, various metals, plastics, ceramics, glass, and more without the need for a primer. It has high fluidity and is designed for easy injection, making it widely applicable from waterproof sealing of electrical and electronic devices to general adhesive applications. - Non-corrosive: Complies with MIL-A-46146B corrosion testing. - Safe to use on highly corrosive metals such as copper and brass. - Fast curing: Tack-free time is only 10 minutes (at 23°C). - Low odor: Releases alcohol vapors during curing (significantly less odor compared to acetate-based products). - Primerless adhesion: Direct adhesion to a wide variety of substrates is possible. - Wide temperature range: Suitable for high and low temperature environments from -55°C to +200°C. - Excellent weather resistance, ozone resistance, and chemical resistance. - Outstanding electrical insulation properties: Ideal for sealing high-voltage components. - One-component formulation for easy handling. For more information, please visit our website.

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Added the heat-dissipating gap filler "TIA225GF" to AD-Chemi.

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Momentive's "TIA225GF" is a two-component addition reaction type liquid silicone material for heat dissipation. The main agent (Component A) and the curing agent (Component B) are mixed in a weight ratio of 1:1 and cured by heating (70°C for 0.5 hours) or at room temperature (23°C for 24 hours). After curing, it becomes a rubber-like elastomer with a thermal conductivity of 2.5 W/(m·K), forming an excellent heat path. This product is a liquid material with excellent thixotropic properties (shape retention), resulting in minimal dripping or smudging after application, making it easy to fill complex-shaped parts and gaps. It ensures stable thermal contact with high followability even on uneven bonding surfaces and narrow gaps, which are difficult to address with conventional thermal interface materials. By containing high-fill fillers, it achieves both high thermal conductivity and electrical insulation, making it suitable for applications requiring high reliability, such as power modules and communication boards.

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The best-selling silicone adhesive TSE39×5 series has been added to AD-Chemi!

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"When in doubt about what to use, start with this" — The reason why this product continues to be chosen by field engineers In the manufacturing and research and development environments of electrical and electronic devices, there are many situations where silicone-based adhesives and sealants need to be selected. When multiple requirements overlap—such as needing heat resistance, wanting to avoid corrosion on certain metals, needing fast curing, or wanting to keep costs down—searching for a product from scratch each time is a waste of time. Many engineers likely have a trusted go-to product that they use when unsure. For many years, this position has been held by Momentive's TSE39×5 series (TSE3925, TSE3975, TSE3995). We will explain in detail, along with technical backing, why this series continues to be a bestseller in many fields.

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安達新産業

安達新産業 本社

Optical Instruments

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Since our founding in Taisho 8 (1919), we have cultivated an extensive network as a chemical industrial trading company and will respond to all of our customers' needs through various surface treatment technologies, including optical thin film processing (optical coating). Company Name: Adachi Shinsangyo Co., Ltd. Representative Director: Kensuke Adachi Capital: 10 million yen Founded: November, Taisho 7 (1918) Established: August, Showa 39 (1964) Location: ■ Head Office: 10F Anix Building, 1-14-20 Tachiuri-bori, Nishi-ku, Osaka 550-0012 Phone: 06-6536-2051 / FAX: 06-6536-2015 ■ Higashi-Osaka Factory: 3-3-1 Tamakushicho Higashi, Higashi-Osaka City 578-0932 Phone: 072-962-4133 / FAX: 072-964-9055 Group Companies: Osaka Vacuum Industry Co., Ltd., Adachi Kousan Co., Ltd.

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