Heat dissipation silicone

In the current era of accelerating high output and miniaturization of electronic devices, the reliability of power devices and various heat-generating components is determined not merely by heat sinks or enclosure structures, but by the "thermal management of interfaces" that connect heat sources and heat dissipation materials. How to reduce the thermal resistance at the interface and maintain stable thermal conductivity over the long term directly impacts product lifespan, safety, and performance. Therefore, the selection of thermal grease has become an important functional material that should be considered from the design stage, rather than just an auxiliary material. Momentive's SilCOOL TIG1000 series is a silicone oil compound in a white grease form, developed to meet these advanced thermal design needs. It is positioned as an easy-to-handle heat dissipation material suitable for mass production processes such as automatic syringe application, screen printing, and stamp printing on assembly lines. The thermal conductivity is stable at 1.0 W/(m·K), and the usable temperature range is wide, from -40 to 170°C. It exhibits excellent thermal conductivity and electrical insulation over a broad temperature range, making it ideal for heat dissipation of various heat-generating components such as power devices, and it is suitable for heat dissipation applications in power and control systems where high reliability is required.

Addition-curing silicone is widely used in various industrial fields such as potting, bonding, coating, and molding of electronic components due to its excellent heat resistance, electrical insulation, and weather resistance. However, in the field, troubles such as "it doesn't cure even though I mixed it according to the recipe," "only the surface is sticky and doesn't cure," and "only the parts that come into contact with specific jigs or substrates experience curing failure" occur quite frequently. Many of these phenomena are referred to as "cure inhibition." Cure inhibition is not due to the poor quality of the silicone itself, but rather occurs when trace amounts of chemicals contained in the surrounding environment or contact materials interfere with the function of the catalyst responsible for the curing reaction. Even trace amounts of the causative substances can have an impact, making it difficult to identify the cause, which can lead to significant yield loss and complaints in the production site. Chapter 1: Curing Mechanism of Addition-Curing Silicone Chapter 2: What is Cure Inhibition? Mechanism of Occurrence Chapter 3: Main Causative Substances and Sources of Cure Inhibition Chapter 4: How to Identify Cure Inhibition and Practical Countermeasures Summary For more details, please check our company website.

We propose Momentive's SILCOOLTIA268GF as a material that meets the increasing "difficulty of thermal design" associated with the high performance and high density of electronic devices. TIA268GF is a thermally conductive gap filler that can be applied with high precision using liquid dispensing, addressing complex shapes and fine clearances that traditional sheet-type gap fillers cannot handle. With a high thermal conductivity of 6.8 W/m·K and silicone properties that maintain flexibility even after curing, it minimizes temperature rise in heat-generating components while reducing stress on substrates and components. Additionally, TIA268GF features excellent processability with a simple 1:1 mixing ratio, a working time of 1 hour at 23°C, and rapid curing in 1 hour at 70°C, enabling stable dispensing application on mass production lines. Its highly non-sagging paste form allows it to "stay in place" on vertical surfaces and wide gaps, making it suitable for thermal management in a wide range of fields such as automotive ECUs, communication devices, and industrial equipment. At Adachi New Industry, we provide comprehensive support for optimizing thermal design, examining application conditions, and prototype assistance using TIA268GF.

Momentive's "TSE322S" is a one-component, heat-curing silicone adhesive sealant optimized for assembly applications where thermal, mechanical, and environmental stresses act in combination, such as in electronic devices and optical modules. This material forms a silicone network with excellent heat resistance, flexibility, and electrical insulation based on a siloxane backbone, achieving high adhesion strength and dimensional stability through heat curing. Since it does not generate by-products during curing, the risk of gas corrosion and void formation is low even in sealed structures and around electronic components, making it suitable for applications requiring long-term reliability. A major feature of TSE322S is its interface formation technology that does not require a primer. The formulation design is less dependent on the polarity and surface energy of the substrate surface, allowing it to exhibit a chemical and physical composite adhesion mechanism to metals such as aluminum, copper, and stainless steel, engineering plastics such as PPS, PBT, and epoxy, as well as inorganic materials like glass and ceramics. This ensures high adhesion stability even in complex module structures that combine dissimilar materials. For more details, please check our website.