The adoption of ultra-small diameter electrodes and the ability to accommodate extremely narrow pitch electrode pins are also possible! Dimensional accuracy is extremely high.
We would like to introduce our "through-electrode glass substrate processing." This technology applies the sealing technology of CCFL, ensuring high airtightness, and allows for the adoption of ultra-small diameter electrodes and extremely narrow pitch for electrode pins to accommodate miniaturization. Additionally, through years of research on glass sealing conditions, the dimensional accuracy of the electrode pin pitch has achieved extremely high precision. 【Features】 ■ Glass substrate with through electrodes ■ Application of CCFL sealing technology ■ Possible adoption of ultra-small diameter electrodes and extremely narrow pitch for electrode pins *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Specifications】 ■ Glass material: D263 (Borosilicate) ■ Glass thermal expansion coefficient: 7.2×10－6/K ■ Electrode material: FeNi (42%) ■ Size: 4 inches to 6 inches ■ Thickness: Min. 350μm ■ Electrode pitch: Up to 800μm ■ Pitch tolerance: Max ±80μm ■ Electrode diameter: 100μm and above ■ Sealing performance: ≧1×10－9Pa·m3/SEC *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■Light sensors ■Various MEMS ■Quartz oscillators *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Aitec Turitani Co., Ltd. is a comprehensive manufacturer of lead wires for electrical and electronic components. Our company possesses original machines that are designed and assembled in-house across many facilities. We strive for daily improvements to better meet our customers' needs.
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