[Processing Example] Measurement of the processed surface using a white light interference microscope.
Wide measurement range exceeding mm units! Measurement examples of polycrystalline ceramics and SiC single crystals.
We would like to introduce a case study of surface measurement using the newly introduced white light interference microscope at our company. The white light interference microscope is a type of microscope that utilizes the phenomenon of light interference to measure and analyze "surface shape." It accommodates surface roughness and line roughness through 3D measurement, regardless of the material being measured. In the measurement of the wire slice surface and polishing surface of polycrystalline ceramics, the results were as follows: slice surface Sa 0.8446 μm, lapping surface Sa 0.2506 μm, and polishing surface Sa 0.00583 μm. Additionally, in the measurement of the polishing surfaces of SiC single crystal and SUS316L, the results were: SiC single crystal Sa 0.000458 μm and SUS316L Sa 0.000302 μm. 【Features of the White Light Interference Microscope】 ■ Non-contact & Surface Measurement - No restrictions on the material being measured - Accommodates surface roughness and line roughness through 3D measurement ■ Wide Measurement Range & High Resolution Measurement - Wide in-plane measurement range exceeding millimeter units - Height resolution of 0.01nm *For more details, please refer to the PDF document or feel free to contact us.
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【Case Summary】 ■ Polycrystalline Ceramics (from wire slice surface to polishing surface) - Slice surface: Sa 0.8446 μm - Lapping surface: Sa 0.2506 μm - Polishing surface: Sa 0.00583 μm ■ SiC Single Crystal, SUS316L (polishing surface) - SiC Single Crystal: Sa 0.000458 μm - SUS316L: Sa 0.000302 μm *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
Our main business focuses on precision processing of various hard materials, specializing in "grinding and cutting," including ceramics, crystalline materials, glass, metals, and resins. In recent years, we have particularly concentrated on ultra-precision cutting and polishing of various ceramics required for electronic components, as well as the power semiconductor field represented by SiC single crystals. In cutting technology, we can perform multi-wire cutting using a fixed abrasive method with diamond wire, and in polishing technology, we can achieve ultra-mirror polishing at the nano level. Additionally, in September 2023, we became Neos Group through M&A, establishing a consistent production system within the group that incorporates Neos's expertise in ultra-precision cleaning technology. If you have any issues with cutting, polishing, or cleaning processes, please feel free to contact Shinko Seisakusho!
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