Calculate the image signal changes of BGA that are not visible in regular X-ray transmission images!
"BGA Pro" is software that identifies characteristic points of void areas in BGA balls from X-ray images and clearly displays the less visible void areas. By quantifying the void state of the BGA, it is possible to evaluate the soldering condition. Additionally, measuring the void state can be utilized as information for setting conditions such as reflow. 【Features】 ■ Calculates changes in image signals of BGA that are not visible in normal X-ray transmission images ■ Quantifies the state of solder balls based on the size of the voids and their position from the center ■ Assists in soldering evaluation *For more details, please refer to the related links or feel free to contact us.
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For more details, please refer to the related links or feel free to contact us.
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Applications/Examples of results
【Applicable Uses】 ■ Evaluate soldering conditions by quantifying the void state of BGA ■ Utilize the measurement of void state as information for setting conditions such as reflow *For more details, please refer to the related links or feel free to contact us.
Company information
Our company is an electronic measuring instrument sales agency established in Yokohama in 1967. We handle current and voltage measuring instruments, frequency measuring instruments, noise and vibration measuring instruments, environmental testing machines, infrared thermography, and more, working to solve the challenges of a wide range of customers, including manufacturers of electrical products, automobile manufacturers, universities, and government agencies. Currently, we are supported by many customers at our nine domestic locations in Tokyo, Yokohama, Atsugi, Hamamatsu, Nagoya, Mie, Kyoto, Osaka, and Okayama, as well as two overseas locations.
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