Thermal Propagation Inspection Device / Thermal Imaging Scope TSI

Non-contact measurement of thermal diffusivity using a laser. Dual-mode observation using heat is possible.

This is a device that performs non-destructive testing of electronic device defects using heat. The "Thermal Imaging Scope TSI" visualizes and quantitatively assesses the thermal characteristics inside the device, allowing for the evaluation of thermal diffusivity at interfaces. The device features two modes: a non-contact mode that applies heat and a mode that utilizes the heat from a heater, enabling the observation of heat flow. Additionally, with detailed settings, tests using individual power supplies can be conducted, allowing for evaluations in actual operational environments. By utilizing infrared camera images and phase analysis graphs, defect inspections can be conducted in a visually comprehensible manner. 〇 About the Measurement Principle 〇 This device observes the locally heated areas using an infrared camera. By analyzing the images from the infrared camera and plotting phase graphs, it becomes possible to visually confirm changes even in cases where it is difficult to make judgments based solely on infrared images. Furthermore, temperature graph plotting is also possible, allowing for the observation of temperature rises and relative temperature changes.

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