CAD function that allows designing new structures.
From single-sided boards to high multilayer boards, configurations can be made without restrictions on layers or libraries. You can set up highly flexible layer structures with combinations of conductors and dielectrics. There is also a mode that can recognize pattern connections through three-dimensional contacts between layers, and various three-dimensional wiring options such as custom vias and bonding wires are equipped. A variety of placement objects can be used. - To accommodate a wide range of devices, a basic library that allows free registration and unique placement objects are provided. - A unique group of wire types: wide/narrow wires, filled solid (hierarchical settings), cut-out, inverted solid, taper lines, dotted/dashed lines, Bwire/Cwire (between layers). - 3D pad objects: pads set in three dimensions can be placed on wiring layers and output as 3D data (usable for IC leads and optical vias, etc.). ◆ The format of the SAVE data database (SSF) is published. Not only can you operate through the command menu, but you can also create the desired layer configuration and pattern shape simply by describing the specified format. *For details, please refer to the catalog available for download below "PDF Download."
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basic information
Product Specifications OS: Compliant with Windows environment Menu Display: Switchable between Japanese / English / Chinese / Korean modes Data Accuracy: 1nm Working Area: 2000m Database: Fully open in ASCII SSF (START STACK FORMAT) Dedicated Programming Language: SeF (START EXECUTE FORMAT) Multi-Open Window: Simultaneous launch of multiple data possible Interface: DXF / 274D / 274X / BMP / GDS2 / ODB++ / ANF / XFL / SPD / DSN / AIF / IDF / IGES / STL Product Lineup: STANDARD / SMART / BASIC / VIEW (free)
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CAD design / CAM editing / data conversion / custom system development
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Company information
The Heterogeneous Integration Tool is a pioneer in mixed technologies. START is a unique CAD/CAM/3D integration tool in the electronics industry. It allows for easy recognition of connections in 3D stacked circuits for LSI/PKG/Board within a seamless single database, enabling pathfinding and modeling. Due to its adoption in "ASET," it has been utilized in several national projects and research institutions. It has been adopted by "PETRA" and continues to be used by IO Core Co., Ltd. Additionally, it has been employed in quantum computer 3DIC applications (such as 3D stacking of chips). From design to manufacturing design and direct control of manufacturing equipment through custom software, it enables efficient collaboration and centralized data management via a unified database (ASCII public). By leveraging the industry's first dedicated programming language standardly included in the system, it incorporates the exceptional proprietary technologies of predecessors into the system, providing automation for data checking, modeling, drawing creation, and equipment interfaces. It supports "cost and quality" through high yield by enhancing the accuracy and speed of development progress, as well as centralized management and reuse of resources.
