Custom-made bare terminals that can be used for connecting substrates and components.
We custom-manufacture pin terminals and lead pins in various configurations according to your needs and purposes. We can create terminals with flanges, terminals with crimping, and terminals bent at 90 degrees, tailored to your specifications. They can be used as pin terminals and lead pins for circuit boards and molded products.
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basic information
- Size: φ0.15 to 2.0mm ☐0.25 to 1.4mm - Material: Copper, brass, phosphor bronze, etc. - Surface treatment: Sn plating, Au plating Other specifications can also be considered.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
Detailed information
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Processing example: 3-stage bending process
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Processing example: Crank bending + header processing
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Processing example: Double crank bending process
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Processing example: U-bending process
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Processing example: Hook bending process
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Example of processing: Crank bending processing
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Processing example: Double flange processing
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Processing example: Rounded corners + dimple star processing
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Processing example: Double hook processing
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Company information
For terminal design, manufacturing, and sales, as well as circuit board connections, turn to Iclex. To provide connection devices that meet customer needs, connection technology, product technology, and manufacturing technology are essential. Iclex is a company that manufactures custom products as standard items using the various know-how it has cultivated over the years.
![[Problem Solving Case] Metal Substrate Interface](https://image.mono.ipros.com/public/product/image/c00/2001503936/IPROS88977109937493638786.png?w=280&h=280)
![[Problem Solving Case] Board-to-Board Connection](https://image.mono.ipros.com/public/product/image/8c4/2001503938/IPROS40604732200448737640.png?w=280&h=280)
![[Problem Solving Example] Connection of FPC and Lead Wire](https://image.mono.ipros.com/public/product/image/7bf/2001503940/IPROS70468532715064542247.png?w=280&h=280)
![[Case Study] Heat Dissipation of Metal Substrates](https://image.mono.ipros.com/public/product/image/b52/2001503946/IPROS00694419965055911874.png?w=280&h=280)
![[Problem Solving Example] Only the necessary pads are gold pads.](https://image.mono.ipros.com/public/product/image/ab2/2001503955/IPROS88625087893079940690.png?w=280&h=280)
